imveliso

Iimbonakalo

1.Umgangatho oPhezulu wokuKhanya kweLaser, uMgangatho oPhezulu weBeam, iNdawo yokuGxininisa encinci, iFine ngakumbi kwaye icace ngakumbi.
I-2.Isantya sokuMakisha ngokukhawuleza kunye nokusebenza kakuhle.
3.INdawo encinci echatshazelwe ngubushushu, akukho futhe lobushushu, izinto eziphathekayo aziyi kuguqulwa, zonakaliswe okanye zitshiswe.
4.Uluhlu olubanzi lweeMpahla eziSebenzayo, eziLungileyo kwiMathiriyeli kunye neMpendulo enkulu yoMbane woBushushu.
5.Akukho zinto eziSebenzayo kunye noLondolozo, ukuSetyenziswa kwamandla aphantsi kunye nokuGcinwa kweendleko.

Izinto Ezisetyenziswayo

Ukumakishwa okuFanelekileyo kwezinto eziKhethekileyo kuSetyenziselwe ikakhulu ukuMakisha kunye noNyango loMphezulu kwiiGlasi ezahlukeneyo, izikrini ze-Lcd, i-Textiles, i-Thin Ceramics, i-Semiconductor Silicon Wafers, i-IC grains, i-Sapphire, i-Polymer Films kunye nezinye izinto.

Ushishino lwezicelo

Isetyenziswa kakhulu kwiMakethi ePhakamileyo ye-Ultra-fine Processing, i-3C ye-Industry Marking, ukuMakisha i-Electronic Components, i-Enclosures yoMbane, ukuMakisha iibhotile zokupakisha ukutya, amayeza kunye nezinye izinto zePolymer;Ukususwa kweeNgxowa zentsimbi okanye ezingezizo iMetallic;Iibhodi zePCB eziguquguqukayo, uDicing;I-Silicon Wafer Micro-hole kunye ne-Blind Hole Processing;I-LCD ye-Crystal Liquid Glass yeglasi ye-Two-dimensional Code yokuMakisha, i-Glass Surface Hole Hole, izitshixo zePlastiki, i-Electronic Components, Izipho, iZixhobo zoNxibelelwano, izixhobo zokwakha, njl.